New Semiconductor Adhesive from DELO

DELO Introduces New Semiconductor Adhesive DELO announced the development of a flexible electronic adhesive that hermetically seals sensor housings on a permanent basis, thereby reliably protecting components such as image sensors. DELO DUALBOND BS3770 meets the demanding standards of the semiconductor and automotive sectors and helps support innovation in autonomous driving. Unlike existing adhesives on the market, the newly developed adhesive is a flexible product with a Young's modulus lower than 5 MPa at room temperature. Thanks to its flexible properties starting from temperatures as low as approximately -50°C, the adhesive can compensate for pressure changes resulting from factors such as temperature fluctuations, humidity differences, or heat input during the reflow process in production. This property prevents situations such as delamination or opening, providing permanent protection to the sensor. DELO DUALBOND BS3770 can be applied precisely using needle dispensing while protecting narrow and high bond lines. Curing takes place in two consecutive stages using UV light and heat. After dispensing, the adhesive is fixed within seconds by conventional light fixation. Alternatively, it can be transferred to stage B, which is particularly suitable for bonding filter glass with black printing. At this stage, initial tack comparable to tape is achieved. The second component can then be joined. Due to the adhesive's initial tack, the component is immediately fixed and can thus be fully processed. Final curing is carried out in a convection oven at +150 °C for 40 minutes. DELO DUALBOND BS3770 is used in image sensors for LiDAR and RADAR applications as well as in driver monitoring and 5G applications. Source